COPPER FOIL, COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, CARRIER-ATTACHED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, LAMINATE, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

COPPER FOIL, COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, CARRIER-ATTACHED COPPER FOIL, CARRIER-ATTACHED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, LAMINATE, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable. A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface r...

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Bibliographische Detailangaben
1. Verfasser: FUKUCHI, Ryo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable. A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 µm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 µm.