ELECTRONIC COMPONENT HOUSING PACKAGE, MULTI-PIECE WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT HOUSING PACKAGE

ELECTRONIC COMPONENT HOUSING PACKAGE, MULTI-PIECE WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT HOUSING PACKAGE

An electronic component housing package includes an insulating substrate (101) having an upper surface including a mount (102) for an electronic component (103), a frame-shaped metallized layer (106) surrounding the mount (102) on the upper surface of the insulating substrate (101), and a metal fram...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWASAKI,Shuichi, ONITSUKA,Yoshitomo
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic component housing package includes an insulating substrate (101) having an upper surface including a mount (102) for an electronic component (103), a frame-shaped metallized layer (106) surrounding the mount (102) on the upper surface of the insulating substrate (101), and a metal frame (108) joined to the frame-shaped metallized layer (106) with a brazing material (107). The frame-shaped metallized layer (106) includes a first sloping portion (109) sloping inwardly from an upper surface to an inner peripheral surface. The brazing material (107) includes a fillet portion (107a) formed between an upper outer periphery of the frame-shaped metallized layer (106) and the metal frame (108), and a filling portion (107b) formed between the first sloping portion (109) and the metal frame (108).