APPARATUS AND METHOD OF PEELING A MULTI-LAYER SUBSTRATE

Methods are provided for processing a first substrate with a first major surface of the first substrate removably bonded to a first major surface of a carrier substrate. Example methods include the step of controlling a bend radius of the carrier substrate while peeling the carrier substrate from th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ALLINGTON, Eric Lewis, WESTBROOK, Jamie Todd, SMITH, Timothy Paul
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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