APPARATUS AND METHOD OF PEELING A MULTI-LAYER SUBSTRATE

APPARATUS AND METHOD OF PEELING A MULTI-LAYER SUBSTRATE

Methods are provided for processing a first substrate with a first major surface of the first substrate removably bonded to a first major surface of a carrier substrate. Example methods include the step of controlling a bend radius of the carrier substrate while peeling the carrier substrate from th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ALLINGTON, Eric Lewis, WESTBROOK, Jamie Todd, SMITH, Timothy Paul
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Methods are provided for processing a first substrate with a first major surface of the first substrate removably bonded to a first major surface of a carrier substrate. Example methods include the step of controlling a bend radius of the carrier substrate while peeling the carrier substrate from the first substrate. In further examples, methods include the step of peeling a leading peripheral edge of the carrier substrate from the first substrate with an attachment member while the attachment member pivots relative to an arm. Example peeling apparatus are also provided with an arm supporting a vacuum attachment member, wherein the arm is pivotally attached to a vacuum plate.