A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO-OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE

The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar...

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Hauptverfasser:	KAIKKONEN, Andrei, SVENSON, Lars-Goete, SMITH, Robert Monroe, LUNDQVIST, Lennart Per Olof, CHACINSKI, Marek Grzegorz
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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creator	KAIKKONEN, Andrei SVENSON, Lars-Goete SMITH, Robert Monroe LUNDQVIST, Lennart Per Olof CHACINSKI, Marek Grzegorz
description	The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar waveguide interconnect (270; 280) comprises a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The coplanar conductors of the pair are electrically connected to each other by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212). The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate (210) having a ground plane layer (212), the interconnect structure comprising a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The conductors of the pair are electrically connected by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212).
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The coplanar waveguide interconnect (270; 280) comprises a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The coplanar conductors of the pair are electrically connected to each other by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212). The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate (210) having a ground plane layer (212), the interconnect structure comprising a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). 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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
title	A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO-OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE
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