A CARRIER LAYOUT FOR AN ELECTRO-OPTICAL MODULE, AN ELECTRO-OPTICAL MODULE USING THE SAME, AND INTERCONNECT STRUCTURE FOR COUPLING AN ELECTRONIC UNIT TO AN OPTICAL DEVICE

The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAIKKONEN, Andrei, SVENSON, Lars-Goete, SMITH, Robert Monroe, LUNDQVIST, Lennart Per Olof, CHACINSKI, Marek Grzegorz
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides a carrier layout for an electro-optical module and respective electro-optical module, the carrier layout comprising a substrate (210) comprising a ground plane layer (212) and a coplanar waveguide interconnect (270; 280) disposed onto the substrate (210). The coplanar waveguide interconnect (270; 280) comprises a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The coplanar conductors of the pair are electrically connected to each other by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212). The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate (210) having a ground plane layer (212), the interconnect structure comprising a pair of coplanar conductors (252, 254; 262, 264) and a central conductor (256; 266) disposed between the pair of coplanar conductors (252, 254; 262, 264). The conductors of the pair are electrically connected by at least one conducting island (272 - 274; 282 - 283) that is isolated from the ground plane layer (212).