DIRECT DIODE LASER PROCESSING DEVICE AND OUTPUT MONITORING METHOD FOR SAME

A direct diode laser processing apparatus includes a laser oscillator (11) including a plurality of laser diodes and emitting a multiple-wavelength laser beam, a transmission fiber (12) transmitting the multiple-wavelength laser beam emitted from the laser oscillator (11), a laser processing machine...

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Bibliographische Detailangaben
1. Verfasser:	OGATA, Minoru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A direct diode laser processing apparatus includes a laser oscillator (11) including a plurality of laser diodes and emitting a multiple-wavelength laser beam, a transmission fiber (12) transmitting the multiple-wavelength laser beam emitted from the laser oscillator (11), a laser processing machine (13) collecting the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece (W), a detecting mechanism (7) sampling part of the multiple-wavelength laser beam and detecting wavelength-by-wavelength light intensities of the sampled laser beam, a monitoring unit (73) monitoring an output decrease in the multiple-wavelength laser beam according to a change in the wavelength-by-wavelength light intensities, and a control module controlling outputs of the plurality of laser diodes according to a monitored result from the monitoring unit. The apparatus properly monitors an output decrease in the multiple-wavelength laser beam.