METHOD FOR PRODUCING A HEAT SPREADING PLATE, HEAT SPREADING PLATE, METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

One aspect relates to a method for producing a heat-spreading plate for a circuit carrier. At least one first layer made of a first material having a first coefficient of expansion and at least one second layer made of a second, low-stretch material having a second coefficient of expansion that is s...

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Bibliographische Detailangaben
1. Verfasser:	Eisele, Ronald
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	One aspect relates to a method for producing a heat-spreading plate for a circuit carrier. At least one first layer made of a first material having a first coefficient of expansion and at least one second layer made of a second, low-stretch material having a second coefficient of expansion that is smaller than the first coefficient of expansion are bonded to each other at a bonding temperature of 150° C.-300° C. by means of a low-temperature sintering process. At least one bonding layer from a bonding material is formed between the first layer and the second layer and the bonding temperature essentially corresponding to the mounting temperature at which the produced heat spreading plate is connected to at least one circuit carrier.