ELECTRICAL BONDING METHOD AND ELECTRICAL BONDING DEVICE

The present invention addresses the problem of obtaining an electrically bonded article in which it is possible to improve the mechanical strength even against violent vibration and the like by superposed members (3, 4) to be bonded, and to do so without giving rise to specks or spatter. A first member (3) to be bonded or a second member (4) to be bonded is provided with a relative displacement amount setting part (4D) for setting the distance of relative displacement of the part (3B) to be bonded in the first member (3) to be bonded and the part (4C) to be bonded in the second member (4) to be bonded during bonding, and a conduction-inhibiting layer (5) is formed on the relative displacement amount setting part (4D). The second member (4) to be bonded or the first member (3) to be bonded is provided with a setting surface (3F) facing the conduction-inhibiting layer (5) of the first member (3) to be bonded or the second member (4) to be bonded. When the first member (3) to be bonded or the second member (4) to be bonded is aligned in position, the distance between the conduction-inhibiting layer (5) and the setting surface (3F) is equal to the width (H) of the bonded part.