CHIP CARD MANUFACTURING METHOD, AND CHIP CARD OBTAINED BY SAID METHOD

CHIP CARD MANUFACTURING METHOD, AND CHIP CARD OBTAINED BY SAID METHOD

A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PROYE, Cyril, EYMARD, Eric, GUERINEAU, Nicolas, PAUL, Christophe
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Beschreibung
Zusammenfassung:A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.