POLISHING MATERIAL, COMPOSITION FOR POLISHING, AND POLISHING METHOD

Abrasives, a polishing composition , and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m 2 /g...

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Bibliographische Detailangaben
Hauptverfasser:	TAMAI, Kazusei, YAMADA, Eiichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Abrasives, a polishing composition , and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m 2 /g or more and 50 m 2 /g or less and an average secondary particle diameter of 0.05 µm or more and 4.8 µm or less. This polishing composition can be used for polishing an outer surface of the resin coating.