VACUUM-ENHANCED HEAT SPREADER

Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less th...

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Bibliographische Detailangaben
Hauptverfasser:	COLLIDGE, Collin, Jennings, LEWIS, Ryan, John, XU, Shanshan, YANG, Ronggui, LIN, Ching-Yi, LIEW, Li-anne, LEE, Yung-cheng
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed.