UNIFORM FLOW HEAT SINK
A uniform flow heat sink is described that is configured to employ variable spacing for air flow channels to account for non-uniformities in air flow due to arrangements of components within a housing of a computing device. Non-uniformities may be ascertained by analysis of an air flow profile for a...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A uniform flow heat sink is described that is configured to employ variable spacing for air flow channels to account for non-uniformities in air flow due to arrangements of components within a housing of a computing device. Non-uniformities may be ascertained by analysis of an air flow profile for a computing device to detect regions of high and low flow. Air flow rates for the computing device may be balanced by configuring air flow channel spacing for the heat sink to vary around a perimeter of the heat sink and account for the ascertained non-uniformities. Air flow channel spacing may be controlled by changing the concentration, spacing, pitch, positioning and/or other characteristics of heat transfer surfaces associated with the heat sink. Generally, air flow channel spacing is increased in areas of high system impedance and decreased in areas of low system impedance to increase uniformity of flow. |
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