SYSTEMS AND METHODS FOR BONDING OF DISSIMILAR SUBSTRATES

The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate (105; 505) may be coupled to a second substrate (120; 520) by a composite joint (110; 510) between the first substrate (105; 505) and the second substrate (120; 520). The comp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MEYER, Jesse C, MARTINA, Raymond P, HANSEN, James O, JALOWKA, Joseph, RIEHL, John D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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