SYSTEMS AND METHODS FOR BONDING OF DISSIMILAR SUBSTRATES

The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate (105; 505) may be coupled to a second substrate (120; 520) by a composite joint (110; 510) between the first substrate (105; 505) and the second substrate (120; 520). The comp...

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Bibliographische Detailangaben
Hauptverfasser:	MEYER, Jesse C, MARTINA, Raymond P, HANSEN, James O, JALOWKA, Joseph, RIEHL, John D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate (105; 505) may be coupled to a second substrate (120; 520) by a composite joint (110; 510) between the first substrate (105; 505) and the second substrate (120; 520). The composite joint (110; 510) may be comprised of a first adhesive material (111; 511) and a second adhesive material (115; 515). The first adhesive material (111; 511) may be disposed on the first substrate (105; 505), and the second adhesive material (115; 515) may be disposed to the first adhesive material (111; 511). The composite joint (110; 510) between the first substrate (105; 505) and the second substrate (120; 520) may provide an isolation layer therebetween, preventing galvanic corrosion.