CONDUCTIVE MEMBER, CONDUCTIVE ROLLER, AND IMAGE FORMING DEVICE

This disclosure is to provide a conductive member capable of obtaining a desired electrical resistance initial value and simultaneously suppressing increase of the electrical resistance value due to continuous energization, a conductive roller comprising an elastic layer formed with the conductive m...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIMOTO, Takuro, ATAMI, Kiyohiko
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTROGRAPHY ELECTROPHOTOGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MAGNETOGRAPHY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHYSICS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	This disclosure is to provide a conductive member capable of obtaining a desired electrical resistance initial value and simultaneously suppressing increase of the electrical resistance value due to continuous energization, a conductive roller comprising an elastic layer formed with the conductive member, and an image forming device using the conductive roller. The conductive member of this disclosure is formed of a UV cure resin obtained by curing under ultraviolet ray radiation a composition containing a urethane (meth)acrylate oligomer (A), a photo polymerization initiator (B) and an ionic conductive agent (C), wherein: the ionic conductive agent (C) contains an organic boron complex salt and a compound having a structure expressed with the following general formula(1), and a compounding amount of the organic boron complex salt is 0.2 parts by mass or more per 100 parts by mass of a curing component in the composition. €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-SO 2 -NX-SO 2 -€ƒ€ƒ€ƒ€ƒ€ƒ(1) (In the general formula (1), X represents an alkali metal.)