CONDUCTIVE MATERIAL FOR CONNECTION PARTS WHICH HAS EXCELLENT FRETTING WEAR RESISTANCE

A conductive material for connection parts according to the present invention is configured in such a manner that a Cu-Sn alloy coating layer having a Cu content of 20 to 70 at% and an average thickness of 0.2 to 3.0 µm and an Sn coating layer having an average thickness of 0.05 to 5.0 µm are formed...

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Bibliographische Detailangaben
Hauptverfasser:	TSURU Masahiro, SUMINO Yuya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CURRENT COLLECTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LINE CONNECTORS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A conductive material for connection parts according to the present invention is configured in such a manner that a Cu-Sn alloy coating layer having a Cu content of 20 to 70 at% and an average thickness of 0.2 to 3.0 µm and an Sn coating layer having an average thickness of 0.05 to 5.0 µm are formed on the surface of a base material made from a copper alloy containing specified amounts of Cr and Zr, or specified amounts of Fe and P or a specified amount of Zn.