A LEADFRAME AND A METHOD OF MANUFACTURING A LEADFRAME

A method of manufacturing a leadframe, comprising inserting an inlay (306) into an indentation (304) in a base layer (302) to provide a leadframe-material (308), wherein the base layer (302) comprises a first material and the inlay (306) comprises a second material; and forming a leadframe (316) fro...

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Bibliographische Detailangaben
Hauptverfasser:	Chau, On Lok, Ng, To Kam, Ho, Wai Keung
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method of manufacturing a leadframe, comprising inserting an inlay (306) into an indentation (304) in a base layer (302) to provide a leadframe-material (308), wherein the base layer (302) comprises a first material and the inlay (306) comprises a second material; and forming a leadframe (316) from the leadframe-material (308). The first material comprises one of copper and Alloy 42, and the second material comprises the other of copper and Alloy 42.