SOLDER INSPECTION APPARATUS AND FEEDBACK INFORMATION GENERATION METHOD FOR SOLDER INSPECTION APPARATUS

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Jeong Yeob, KIM, Sa Woong
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES REGULATING SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.