THERMAL INTERFACE MATERIAL

THERMAL INTERFACE MATERIAL

Low Volatile Organic Content (VOC) thermal interface materials are described. The thermal interface materials include heat conducting fillers such a hexagonal boron nitride dispersed in a block copolymer resin system. Depending on the requirements, tackifiers and plasticizers may be included in the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Bieber, Pierre Reinhard, Eichler, Jens, Schiller, Marion
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:Low Volatile Organic Content (VOC) thermal interface materials are described. The thermal interface materials include heat conducting fillers such a hexagonal boron nitride dispersed in a block copolymer resin system. Depending on the requirements, tackifiers and plasticizers may be included in the resin system while still retaining low VOC levels.