COPPER-TIN ALLOY PLATING BATH

An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble co...

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Bibliographische Detailangaben
Hauptverfasser:	NAGAO, Toshimitsu, KATAYAMA, Junichi, HARA, Kenji, OTSUKA, Kuniaki, TSUJIMOTO, Takamitsu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): R-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R(1), wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.