A PROCESS FOR PHYSICAL VAPOR DEPOSITION OF A MATERIAL LAYER ON SURFACES OF A PLURALITY OF SUBSTRATES

The present invention relates to a process of physical vapor deposition of a material layer on surfaces of a plurality of substrates (11), wherein: - the plurality of substrates (11) are arranged on a dome (12) which rotates according to a dome rotation axis (300); - the material to be deposited is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	BEINAT, Olivier
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a process of physical vapor deposition of a material layer on surfaces of a plurality of substrates (11), wherein: - the plurality of substrates (11) are arranged on a dome (12) which rotates according to a dome rotation axis (300); - the material to be deposited is vacuum evaporated thanks to an energy beam from a target (13); - the energy beam interacts with a beam impact surface of the target chosen within the list consisting of a part of a main surface (15) and a part of an edge (14) of the target and wherein the material diffuses from the target to the substrates around a main diffusion axis (100); and - the angle ± between the dome rotation axis (300) and the main diffusion axis (100) is chosen within the ranges of +5° to +40° or -5° to -40°.