METHOD FOR PRODUCING A SUBSTRATE ADAPTER, SUBSTRATE ADAPTER, AND METHOD FOR CONTACTING A SEMICONDUCTOR ELEMENT

The invention relates to a method for producing a substrate adapter (27), which is used in particular to contact semiconductor elements (32), comprising the following steps: - applying a contacting material (13) to one side (12) of a carrier (10), - structuring an electrically conductive metal eleme...

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Bibliographische Detailangaben
Hauptverfasser:	SCHÄFER, Michael, BLEIFUSS, Martin, ULRICH, Holger, HINRICH, Andreas, RUDZKI, Jacek, SCHEFUSS, Frank, OSTERWALD, Frank, PAULSEN, Lars, BACHMANN, Christian, KLEIN, Andreas Steffen, WIESELER, Elisa, BECKER, Martin, KRÜGER, Frank, BENNING, David
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a method for producing a substrate adapter (27), which is used in particular to contact semiconductor elements (32), comprising the following steps: - applying a contacting material (13) to one side (12) of a carrier (10), - structuring an electrically conductive metal element, - positioning the structured metal element (15) on the carrier (10) in such a way that a first side (17) of the metal element (15) and the side (12) of the carrier (10) provided with the contacting material (13) are arranged facing each other, - joining the structured metal element (15) to the carrier (10) provided with contacting material (13), - applying a transfer element (22) to a second side (20) of the structured metal element (15), and - separating the transfer element (22) and/or the structured metal element (15), which is joined by means of contacting material (13), for further processing.