STRUCTURE AND METHOD OF BATCH-PACKAGING LOW PIN COUNT EMBEDDED SEMICONDUCTOR CHIPS

A method for fabricating packaged semiconductor devices in panel format. A flat panel sheet dimensioned for a set of contiguous chips includes a stiff substrate of an insulating plate, and a tape having a surface layer of a first adhesive releasable at elevated temperatures, a core base film, and a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MASUMOTO, Mutsumi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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