RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Disclosed is a resin composition including a polyamide (A), a polyester (B) and a white pigment (C), wherein (A) has a melting point of 280°C or higher, (B) is polycyclohexylenedimethylene terephthalate, a mass ratio (A/B) is 5/95 to 95/5, and a content of (C) is 10 to 150 parts by mass in relation...

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Bibliographische Detailangaben
Hauptverfasser:	KAMIKAWA Hiroo, MII Junichi, KABASHIMA, Yohei, AMARI Taiyo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Disclosed is a resin composition including a polyamide (A), a polyester (B) and a white pigment (C), wherein (A) has a melting point of 280°C or higher, (B) is polycyclohexylenedimethylene terephthalate, a mass ratio (A/B) is 5/95 to 95/5, and a content of (C) is 10 to 150 parts by mass in relation to 100 parts by mass of a total amount of (A) and (B).