ROLLER TRANSFER APPLICATION METHOD AND APPLICATION DEVICE FOR HOT-MELT ADHESIVE

The purpose of the present invention is to apply a hot-melt adhesive in a thin-film state only to top surfaces of pattern roller protrusions. This roller transfer application method for a hot-melt adhesive is characterized: in that a coater head having a slot in a direction towards an axis center of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIDAKA, Shoji, SAKAI, Hisashi, TARUMI, Seiki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to apply a hot-melt adhesive in a thin-film state only to top surfaces of pattern roller protrusions. This roller transfer application method for a hot-melt adhesive is characterized: in that a coater head having a slot in a direction towards an axis center of the roller is provided facing a pattern surface of the pattern roller; and by supplying the hot-melt adhesive, which is supplied from a hot-melt adhesive supply device, in a thin-film state to a pattern top surface of the pattern roller, and thus the thin-film hot-melt adhesive is only supplied to the top surfaces of pattern roller protrusions. This method is further characterized by supplying the hot-melt adhesive only to the top surfaces of the pattern roller protrusions by opening an on-off-type hot-melt adhesive supply control valve, which is attached to the coater head, when an adhesive opening on the bottom surface of the coater head is facing application zones on the pattern surface of the pattern roller. The present invention has the effect of satisfactorily maintaining a work environment by preventing contamination of the device periphery.