METHOD FOR PRODUCING CURED PRODUCT OF EPISULFIDE-BASED RESIN

The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a m...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NAMIKI Kousuke, HORIKOSHI Hiroshi, FUSE Sawako, FURUKAWA Kikuo, KOSHIISHI Eiji
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON CONTACT LENSES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a mold; and (C) a step in which, by increasing the temperature of a heating medium, the composition for a resin is polymerized in the heating medium that contains a liquid having a thermal conductivity of 0.2 W/m·K or higher, or in a shower of the heating medium. The maximum temperature of the heating medium in step (C) is 55 to 110°C. (a) A compound which has two episulfide groups per molecule and which is represented by formula (1): wherein m represents an integer from 0 to 4 and n represents an integer from 0 to 2 (b) A compound having one or more thiol groups per molecule.