ELECTRONIC COMPONENT MOUNTING DEVICE

A component mounting device (1) includes a mounting head (6B) that is movable in a horizontal direction and mounts a held component (C) on a substrate (P) and a control portion (111) that controls the operation of the mounting head, and the control portion is configured to perform control of making...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHII, Takashi, IZUHARA, Koichi, OHNISHI, Seiji, WATANABE, Hiroyuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A component mounting device (1) includes a mounting head (6B) that is movable in a horizontal direction and mounts a held component (C) on a substrate (P) and a control portion (111) that controls the operation of the mounting head, and the control portion is configured to perform control of making a speed of mounting, by the mounting head, a component to be closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate, smaller than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be closely adjacent to another component, on the substrate.