THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE

The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglom...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wieneke, Mr. Jan, Rieder-Otterburg, Susanne, Uibel, Krishna, Kuester, Frank, Raynoschek, Simone, Kayser, Armin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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