THERMALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVE

The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d 50 comprised between 100 and 420 µm; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d 50 comprised between 3 and 25 µm; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d 50 which is lower than the first average agglomerate size d 50 ; iv. optionally, a third type of hexagonal boron nitride primary particle agglomerates having a third average agglomerate size d 50 , wherein the third average agglomerate size d 50 is lower than the first average agglomerate size d 50 and is different from second average agglomerate size d 50 ; and wherein the hexagonal boron nitride primary particles have a platelet shape; wherein the envelope density of the first type of agglomerates, and optionally, the second type of agglomerates and the third type of agglomerates, are comprised between 0.3 and 2.2 g/cm 3 , when measured according to the test method described in the experimental section; and wherein the content of the boron nitride mixture composition is greater than 15 vol%, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.