FLEXIBLE DEVICE

Provided are a flexible device which includes a conductive bonding layer and thereby offers easy bonding between unit flexible devices, and a flexible device module which includes two or more flexible devices bonded by conductive bonding.

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Kwang Su, CHOI, Kwan Min, HAHN, Jung Seok, KU, Ja Ram, KIM, Eun Uk, CHOI, Yoon Young
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Provided are a flexible device which includes a conductive bonding layer and thereby offers easy bonding between unit flexible devices, and a flexible device module which includes two or more flexible devices bonded by conductive bonding.