METHOD FOR PRODUCING A CHIP MODULE

METHOD FOR PRODUCING A CHIP MODULE

The present invention discloses a chip module (2), which is inserted into a card body (14) of a portable data carrier (22) and is permanently connected to it, wherein the module (2) comprises a substrate (4), wherein at least one electrically conductive contact (10) is arranged on one side of the su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TARANTINO, Thomas
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present invention discloses a chip module (2), which is inserted into a card body (14) of a portable data carrier (22) and is permanently connected to it, wherein the module (2) comprises a substrate (4), wherein at least one electrically conductive contact (10) is arranged on one side of the substrate (4), wherein at least one chip (12) is arranged on another side of the substrate (4), which side is arranged opposite to the side on which the at least one contact (10) is arranged, wherein the chip (12) has at least one connection (10) which is electrically conductively connected to at least one contact (10), characterized in that the substrate (4) has at least one first area (6) which is permeable to laser light, and has at least one second area (8) which is impermeable to laser light, so that the chip module (2) is connected to the card body (14) e.g. by means of a laser welded connection.