HEAT-TREATMENT DEVICE AND HEAT-TREATMENT METHOD

A heat-treatment device 10 includes a table 11 on which a ring-shaped workpiece W can be placed, and a pair of heat processing units 20 for heat-processing the peripheral surface of the workpiece W. The heat-treatment device 10 is used for obtaining the workpiece W having desired properties by the h...

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Bibliographische Detailangaben
Hauptverfasser: SHIMBE, Junzo, NAKABAYASHI, Hiroshi, YOSHIYA, Kazuki, KAI, Hiroyuki, MASUBUCHI, Shuji, SAKANOUE, Takayuki, NAGATA, Makoto
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A heat-treatment device 10 includes a table 11 on which a ring-shaped workpiece W can be placed, and a pair of heat processing units 20 for heat-processing the peripheral surface of the workpiece W. The heat-treatment device 10 is used for obtaining the workpiece W having desired properties by the heat-processing the workpiece W while the pair of heat processing units 20 move in opposite directions along the peripheral surface of the workpiece W. The heat-treatment device 10 is configured in such a way that a pair of revolving arms 30 movable relative to the table 11 oscillate the pair of heat processing units 20 relative to the workpiece W, thereby heat-processing the peripheral surface of the workpiece W. By adopting such a configuration, it is possible to obtain a heat-treatment device heat-processing the entire circumference of a ring-shaped workpiece.