METHOD FOR MANUFACTURING MULTILAYER FILM, AND MULTILAYER FILM

A method of manufacturing a multi-layered film of the invention includes: forming an electroconductive layer (3) on a substrate (2, 31); forming a seed layer (4) including an oxidative product having a perovskite structure so as to coat the electroconductive layer (3) by a sputtering method; and for...

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Bibliographische Detailangaben
Hauptverfasser:	HENMI Mitsunori, KOBAYASHI Hiroki, KIMURA Isao, HIROSE Mitsutaka, TSUKAGOSHI Kazuya, SUU Koukou
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of manufacturing a multi-layered film of the invention includes: forming an electroconductive layer (3) on a substrate (2, 31); forming a seed layer (4) including an oxidative product having a perovskite structure so as to coat the electroconductive layer (3) by a sputtering method; and forming a dielectric layer (5) so as to coat the seed layer (4).