LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND LIGHTING DEVICE INCLUDING THE SAME

A light source module includes at least one light source (11), and a body supporting the light source. The body includes a heat sink (120) supporting the light source (11) on a top surface thereof, the heat sink (120) absorbing heat from the light source (11) and dissipating the heat to the outside,...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Jaechan, CHANG, Hyeuk, JUN, Sumin, KIM, Injoong, HONG, Jaepyo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A light source module includes at least one light source (11), and a body supporting the light source. The body includes a heat sink (120) supporting the light source (11) on a top surface thereof, the heat sink (120) absorbing heat from the light source (11) and dissipating the heat to the outside, an insulating layer (20) provided on at least one surface of the heat sink (120), the insulating layer (20) having electrical insulating properties, and a conductive layer (40) provided on the insulating layer (20). The conductive layer (20) includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source (11) mounted therein. A protective layer (60) is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.