METHOD AND DEVICE FOR INSPECTION OF A SEMICONDUCTOR DEVICE

A method for inspection of a semiconductor device (10) comprises: performing a processing step in manufacturing of the semiconductor device (10), wherein a compound is at least in contact with the semiconductor device (10); capturing an image on a two-dimensional image sensor (34) of an area of at least part of the semiconductor device (10), wherein the captured image (46) comprises spectral information for a plurality of positions in the area, wherein said spectral information comprises intensity of incident electromagnetic radiation for a plurality of different wavelength bands across a spectrum of wavelengths; processing the spectral information of the captured image (46) for each of the plurality of positions to determine whether residue of the compound is present in the position; and outputting information indicating positions for which residue of the compound is present for controlling a subsequent processing step in manufacturing of the semiconductor device (10).