RESIN COMPOSITION FOR PRINTED-CIRCUIT BOARD, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED-CIRCUIT BOARD

A resin composition for a printed wiring board comprising: a cyanate compound (A) represented by the following general formula (1); and an epoxy resin (B), wherein Ar 1 represents an aryl group, Ar 2 each independently represents a divalent substituent selected from the group consisting of a phenylene group, a naphthylene group, and a biphenylene group, Ar 3 each independently represents a p+1-valent substituent selected from the group consisting of a p+1-valent phenyl group, a p+1-valent naphthyl group, and a p+1-valent biphenyl group, R 1 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, and an aryl group, R 2 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, and a cyanato group, n represents number of cyanato groups bonded to Ar 1 and is an integer of 1 to 3, m represents number of R 1 bonded to Ar 1 , n + m + 2 is equal to or less than number of possible bonds to Ar 1 , p represents number of R 2 bonded to Ar 3 and is an integer of 1 to 9, x and y represent a ratio of repeating units, x is 1, whereas y is 0.25 to 2.0, and the repeating units for x and y may each be continuously arranged or may be alternately or randomly arranged with each other.