MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT
A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface th...
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| creator | MIYAJIMA, Kentarou HIO, Masayuki SOMA, Atsuo ASHIDA, Kisho OOTA, Hiroyuki HATA, Shohei YAMAGUCHI, Takuto KAZAMA, Atsushi ONOZUKA, Junji SHIMOKAWA, Hanae |
| description | A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3101400B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3101400B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3101400B13</originalsourceid><addsrcrecordid>eNrjZDDxdXX2cPTzdHb0UQgMdfQL8QyJVPB1dQwODfL0c1dwcQ3zdHZVcPRzUQh29Qv2D1II9fMM4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxoYGhiYGBk6GxkQoAQB9Mibj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT</title><source>esp@cenet</source><creator>MIYAJIMA, Kentarou ; HIO, Masayuki ; SOMA, Atsuo ; ASHIDA, Kisho ; OOTA, Hiroyuki ; HATA, Shohei ; YAMAGUCHI, Takuto ; KAZAMA, Atsushi ; ONOZUKA, Junji ; SHIMOKAWA, Hanae</creator><creatorcontrib>MIYAJIMA, Kentarou ; HIO, Masayuki ; SOMA, Atsuo ; ASHIDA, Kisho ; OOTA, Hiroyuki ; HATA, Shohei ; YAMAGUCHI, Takuto ; KAZAMA, Atsushi ; ONOZUKA, Junji ; SHIMOKAWA, Hanae</creatorcontrib><description>A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190904&DB=EPODOC&CC=EP&NR=3101400B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190904&DB=EPODOC&CC=EP&NR=3101400B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAJIMA, Kentarou</creatorcontrib><creatorcontrib>HIO, Masayuki</creatorcontrib><creatorcontrib>SOMA, Atsuo</creatorcontrib><creatorcontrib>ASHIDA, Kisho</creatorcontrib><creatorcontrib>OOTA, Hiroyuki</creatorcontrib><creatorcontrib>HATA, Shohei</creatorcontrib><creatorcontrib>YAMAGUCHI, Takuto</creatorcontrib><creatorcontrib>KAZAMA, Atsushi</creatorcontrib><creatorcontrib>ONOZUKA, Junji</creatorcontrib><creatorcontrib>SHIMOKAWA, Hanae</creatorcontrib><title>MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT</title><description>A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxdXX2cPTzdHb0UQgMdfQL8QyJVPB1dQwODfL0c1dwcQ3zdHZVcPRzUQh29Qv2D1II9fMM4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxoYGhiYGBk6GxkQoAQB9Mibj</recordid><startdate>20190904</startdate><enddate>20190904</enddate><creator>MIYAJIMA, Kentarou</creator><creator>HIO, Masayuki</creator><creator>SOMA, Atsuo</creator><creator>ASHIDA, Kisho</creator><creator>OOTA, Hiroyuki</creator><creator>HATA, Shohei</creator><creator>YAMAGUCHI, Takuto</creator><creator>KAZAMA, Atsushi</creator><creator>ONOZUKA, Junji</creator><creator>SHIMOKAWA, Hanae</creator><scope>EVB</scope></search><sort><creationdate>20190904</creationdate><title>MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT</title><author>MIYAJIMA, Kentarou ; HIO, Masayuki ; SOMA, Atsuo ; ASHIDA, Kisho ; OOTA, Hiroyuki ; HATA, Shohei ; YAMAGUCHI, Takuto ; KAZAMA, Atsushi ; ONOZUKA, Junji ; SHIMOKAWA, Hanae</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3101400B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAJIMA, Kentarou</creatorcontrib><creatorcontrib>HIO, Masayuki</creatorcontrib><creatorcontrib>SOMA, Atsuo</creatorcontrib><creatorcontrib>ASHIDA, Kisho</creatorcontrib><creatorcontrib>OOTA, Hiroyuki</creatorcontrib><creatorcontrib>HATA, Shohei</creatorcontrib><creatorcontrib>YAMAGUCHI, Takuto</creatorcontrib><creatorcontrib>KAZAMA, Atsushi</creatorcontrib><creatorcontrib>ONOZUKA, Junji</creatorcontrib><creatorcontrib>SHIMOKAWA, Hanae</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAJIMA, Kentarou</au><au>HIO, Masayuki</au><au>SOMA, Atsuo</au><au>ASHIDA, Kisho</au><au>OOTA, Hiroyuki</au><au>HATA, Shohei</au><au>YAMAGUCHI, Takuto</au><au>KAZAMA, Atsushi</au><au>ONOZUKA, Junji</au><au>SHIMOKAWA, Hanae</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT</title><date>2019-09-04</date><risdate>2019</risdate><abstract>A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having a seat that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | MECHANICAL QUANTITY MEASURING DEVICE AND SENSOR UNIT |
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