IMPEDANCE MATCHING CONFIGURATION INCLUDING BONDWIRES

IMPEDANCE MATCHING CONFIGURATION INCLUDING BONDWIRES

A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wir...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Heeres, Rob Mathijs, Volokhine, Iouri, Van Der Zanden, Josephus, Zhu, YI
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
AMPLIFIERS
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wire connections coupled between the second terminal and a first bond pad on the die, and second bond wire connections coupled between the first bond pad and a second bond pad coupled to the first capacitor.