THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAME

Provided is a highly reliable three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. Provided is a three-dimensional circuit board (10) comprising a circuit (2) formed on a three-dimensional...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YONEDA, NAOKI, USHIKI, SHIGERU, SHIMAMIYA, AYUMU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a highly reliable three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. Provided is a three-dimensional circuit board (10) comprising a circuit (2) formed on a three-dimensional board (1) and a component mount unit (3). A solder resist (4) is formed such that a component mount unit (3) is open, and an electronic component is mounted on a component mount unit (3) with solder. Preferably, a solder resist (4) is a photoresist, and preferably, a three-dimensional board 1 is a resin molding and a circuit (2) is formed on a resin molding.