SEMICONDUCTOR DIE ATTACHMENT FOR HIGH VACUUM TUBES

An ultra-high vacuum tube as an imaging device comprises a semiconductor die (10) including multiple bonding pads (9) arrayed symmetrically on a surface of the die, the bonding pads (9) being electrically isolated; a housing (17) of a different material than the semiconductor die, said housing inclu...

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Bibliographische Detailangaben
Hauptverfasser:	COSTELLO, KENNETH A, RODERICK, KEVIN J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING ORCONTROL PURPOSES FLUID-PRESSURE ACTUATORS HEATING HYDRAULICS OR PNEUMATICS IN GENERAL LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An ultra-high vacuum tube as an imaging device comprises a semiconductor die (10) including multiple bonding pads (9) arrayed symmetrically on a surface of the die, the bonding pads (9) being electrically isolated; a housing (17) of a different material than the semiconductor die, said housing including matching bonding pads (25) on an inner surface of the housing; a brazing material (29) having a melting point of less than 200°C positioned between said bonding pads (9) of said die (10) and said matching bonding pads (25) of said housing (17) to connect said die (10) to said housing (17) in alignment; and an ultra high vacuum enclosed in said housing (17) formed by a baking process at a temperature above 200°C at which the brazing material (29) re-melts.