TITANIUM NITRIDE HARD MASK REMOVAL
Composition, method and system for PVD TiN hard mask removal from 28/20nm pattern wafers have been disclosed. The composition uses peroxide as oxidizing agent for PVD TiN hard mask removal under slightly basic conditions. The composition comprises bulky or long chain organic amines or polyalkylamine...
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creator | Liu, Wen Dar Chen, Tianniu Casteel Jr., William Jack Agarwal, Rajiv Krishan Rao, Madhukar Bhaskara Lee, Yi-Chia |
description | Composition, method and system for PVD TiN hard mask removal from 28/20nm pattern wafers have been disclosed. The composition uses peroxide as oxidizing agent for PVD TiN hard mask removal under slightly basic conditions. The composition comprises bulky or long chain organic amines or polyalkylamine to improve removal/etching selectivity of PVD TiN vs CVD TiN. The composition further comprises long chain organic acids or amines to maintain Co compatibility. |
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The composition uses peroxide as oxidizing agent for PVD TiN hard mask removal under slightly basic conditions. The composition comprises bulky or long chain organic amines or polyalkylamine to improve removal/etching selectivity of PVD TiN vs CVD TiN. The composition further comprises long chain organic acids or amines to maintain Co compatibility.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200513&DB=EPODOC&CC=EP&NR=3089200B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200513&DB=EPODOC&CC=EP&NR=3089200B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Liu, Wen Dar</creatorcontrib><creatorcontrib>Chen, Tianniu</creatorcontrib><creatorcontrib>Casteel Jr., William Jack</creatorcontrib><creatorcontrib>Agarwal, Rajiv Krishan</creatorcontrib><creatorcontrib>Rao, Madhukar Bhaskara</creatorcontrib><creatorcontrib>Lee, Yi-Chia</creatorcontrib><title>TITANIUM NITRIDE HARD MASK REMOVAL</title><description>Composition, method and system for PVD TiN hard mask removal from 28/20nm pattern wafers have been disclosed. 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The composition uses peroxide as oxidizing agent for PVD TiN hard mask removal under slightly basic conditions. The composition comprises bulky or long chain organic amines or polyalkylamine to improve removal/etching selectivity of PVD TiN vs CVD TiN. The composition further comprises long chain organic acids or amines to maintain Co compatibility.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | TITANIUM NITRIDE HARD MASK REMOVAL |
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