POLYAMIDE MOULDING MATERIAL AND ITS APPLICATION

Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.