MAINBOARD STRUCTURE AND TERMINAL

Embodiments of the present invention relate to the field of communications, and disclose a mainboard structure and a terminal, in which an overall thickness of the terminal is reduced. A specific solution is as follows: A mainboard structure includes a printed circuit board PCB mainboard, where at l...

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Bibliographische Detailangaben
Hauptverfasser:	LIANG, Huanbing, LI, Chao, LI, Quanli, ZHU, Guangyao
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES TELEPHONIC COMMUNICATION
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Beschreibung
Zusammenfassung:	Embodiments of the present invention relate to the field of communications, and disclose a mainboard structure and a terminal, in which an overall thickness of the terminal is reduced. A specific solution is as follows: A mainboard structure includes a printed circuit board PCB mainboard, where at least one hollow zone is arranged on the PCB mainboard; and the mainboard structure further includes: a land grid array LGA module one-to-one corresponding to the hollow zone, where an area of a first surface of the LGA module is greater than an area of the hollow zone corresponding to the LGA module; the first surface of the LGA module includes a first region and a second region, where the first region corresponds to the hollow zone, and is used for arranging a key-height component thereon; and the second region is electrically connected to a first surface of the PCB mainboard.