CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR

The present specification provides a conductive structure body and a method for manufacturing the same.

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Bibliographische Detailangaben
Hauptverfasser:	JANG, Song Ho, KIM, Yong Chan, KIM, Ki-Hwan, YOON, Junghwan, LEE, Ilha, LIM, Jin Hyong, PARK, Chan Hyoung
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present specification provides a conductive structure body and a method for manufacturing the same.