ADHESIVE COMPOSITION

Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Hyun Cheol, KWON, Yoon Kyung, PARK, Yong Su, LEE, Hui Je, PARK, Hyon Gyu, JUNG, Say Young, KIM, Hak Lim, LEE, Dae Hyuck
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided are a pressure sensitive adhesive composition, a conductive laminate protective film, and a conductive laminate. A cured product of the pressure sensitive adhesive composition according to the present application constitutes a pressure sensitive adhesive layer attached on a hard coating surface of a conductive laminate or the like, so that a surface of the conductive laminate or the like can be protected as well as that a peeling force can be maintained appropriately regardless of a peeling rate even after a heat treatment for sintering, and thus can be used for a protective film.