ROBUST ULTRASOUND TRANSDUCER PROBES HAVING PROTECTED INTEGRATED CIRCUIT INTERCONNECTS

An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structu...

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Bibliographische Detailangaben
Hauptverfasser: SCARSELLA, Michael, SUDOL, Wojtek
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.