SOLDERED COMPONENTS FOR DOWNHOLE USE

The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Dupouy, Francis, McCluskey, F. Patrick, Kostinovsky, Mark Alex, Schilling, Glen Dell, Patel, Chandradip Pravinbhai, Iafrate, Gilles
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.