DEPOSITION DEVICE AND DEPOSITION METHOD

A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is c...

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Bibliographische Detailangaben
Hauptverfasser:	HIRASAWA, Tatsuo, SUZUKI, Yusuke, SATO, Keisuke, SONE, Hiroshi, TAKATSUKI, Koichi, KOJIMA, Yasuhiko, SHIMADA, Atsushi, GOMI, Atsushi, NAKAMURA, Kanto, SUZUKI, Yasunobu, YASUMURO, Chiaki, KITADA, Toru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region. ABSTRACT AS PUBLISHED This deposition device is provided with a treatment container. A mounting platform is arranged in the treatment container, and a metal target is provided above the mounting platform. Further, a head is configured to jet an oxidizing gas towards the mounting platform. This head can move between a first region, which is between the metal target and the mounting region where workpieces are mounted on the mounting platform, and a second region which is separated from the space between the metal target and the mounting region.