Thermally conductive adhesive

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MARKIEFKA, PATRICK, BUTTERBACH, RÜDIGER, SIEPENKOTHEN, JUDITH, SCHUBERT, CARSTEN, KOPANNIA, SIEGFRIED
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.